Encapsulation
SOIC-8(6)
-(1)
LSSOP(1)
QFN-24(1)
TSSOP-16(1)
QFN-32(5)
WFQFN-48(2)
QCCN(1)
WFQFN-40(5)
QFN-16(4)
DFN-8(2)
VFQFN-24(3)
SON(2)
DIE(7)
QFN-48(1)
WFQFN-32(1)
QFN-20(1)
SOT-363-6(2)
QFN-14(1)
NI-360(1)
HTSON(1)
QFN-22(2)
1.49 mm x 0.85 mm x 0.085 mm(1)
CSP-3(2)
PowerVFQFN-28(1)
Laminate-16(1)
SOT-89-3(2)
(372)
SOT-89(2)
SOT-23-6(5)
Module-24(1)
DIE (2.641 mm x 1.48 mm) / Wafer(1)
4.35 mm x 3.9 mm(1)
Die 18(2)
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Packaging
(442)
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Category/Description
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